Feature 24c04wp Chipset
In every motherboard generation on AMD’s AM4 socket 24c04wp, we have seen a premium motherboard chipset and a more budget friendly chipset play out in the market. For the latest generation, focusing on Ryzen 3000 processors, we only have the X570 chipset in the market right now, and we’re expecting to see a B550 chipset and motherboards built on that chipset at somepoint in the future.
B550 hasn’t been announced yet, but one avid Reddit user has spotted an OEM system built on the B550A chipset in stores. The existance of B550A has been verified by an AMD employee. AMD’s B550A chipset belongs to the company’s Promontory-LP family (B450) and therefore supports 2+4 PCIe Gen 3 lanes, two USB 3.2 Gen 2 links, and six USB
Comet Lake U&Y 495 Chipset Datasheet: x8 Link, USB 3.2 Gen 2 Support
Intel has published datasheet of its upcoming Intel 495-series chipsets revealing their key features. As it turns out, the family will feature two chipsets aimed at different types of premium laptops, one for Y series and one for U series.
Intel’s 495 chipsets will be compatible with ‘Premium-U’ and ‘Premium-Y’ processors featuring an OPI x8 interface with up to 4 GT/s data transfer rate. Intel’s 495-series PCH will also support up to 16 PCIe 3.0 lanes, up to three Serial ATA ports, up to six USB 3.2 Gen 2 ports (10 Gbps), up to 10 USB 2.0 connectors, an integrated GbE MAC, a built-in Wi-Fi MAC that requires a CNVi module, and all the other familiar features of Intel’s modern chipsets (e.g., RST, AMR, TXT, VT, etc.).
Intel does not disclose in its document codenames of CPUs to be supported by its 495 chipsets, but it is likely that the new PCH will support the company’s latest 10th Generation Core processors known as Ice Lake and Comet Lake. Meanwhile, it remains to be seen which Intel’s chipsets support the manufacturer’s upcoming desktop CPUs.
Intel does not often disclose its own chipset names in advance, 24c04wp but from time to time we get glimpses into accidental publication. This week, driver documents from the company show software support for unannounced 400-series and 495 chipsets, which are led to believe will be for future generations of products, following on from the 300-series products.
As it turns out, Intel’s chipset drivers have supported the company’s 400-series and 495 chipsets as of mid-August. Software support may indicate that the launch of Intel’s new platforms is imminent. Meanwhile, we can only guess about their specifications and capabilities.
Another interesting addition to Intel’s family of chipsets is the H310D PCH, found in the same document. Based on its name, we can suspect that this is a yet another version of the entry-level H310, but we have no idea about its peculiarities. The original H310 was built on 14nm, the H310C was built on 22nm, so who knows what the H310D will be
Intel Adds B365 Chipset to Lineup: The Return of 22nm
Intel has quietly added a new chipset that is made using the company’s 22 nm fabrication process to its 300-series lineup. As the name suggests, the Intel B365 PCH for desktop PCs has a similar positioning with the company’s B360 chipset, but the two products have many differences apart from their manufacturing technologies. Meanwhile, the launch of a 22 nm product is expected to free up some capacity for 14 nm products, such as CPUs
Intel’s B365 PCH belongs to the 300-series chipsets, so it has to support Intel’s latest processors and select platform features. At the same time, the chip is made using Intel’s 22 nm fabrication process and therefore formally belongs to the Kaby Lake family. In fact, key specs of the B365 resemble those of the H270 with some minor differences. Therefore, we might be dealing with a renamed and re-certified silicon here, and although Intel has not confirmed this, there are some unofficial indicators about the rename.
The new B365 chipset supports 20 PCIe 3.0 lanes, up from 12 supported by the B360. Furthermore, the B365 PCH also supports hardware RAID for PCIe and SATA storage devices, something that the B360 lacks.
Meanwhile, the B365 24c04wp does not feature an integrated USB 3.1 Gen 2 controller and does not support CNVi Wi-Fi + BT companion RF modules (such as the Wireless-AC 9560 that supports up to 1.73 Gbps throughput over 160 MHz channels), essentially losing two major advantages that Intel’s 300-series platforms have over predecessors. To enable USB 3.1 Gen 2 and Gigabit-class Wi-Fi speeds, motherboard makers will have to install standalone controllers, which will consume PCIe lanes and increase BOM costs of motherboards as well as PCs.
The B365 is not the first Intel 300-series chipset to be made using the company’s 22 nm process technology. Earlier this year the company quietly launched its H310C, which is allegedly fabbed using the same tech.
By moving production of chipsets to an older node Intel frees up its 14 nm capacities for higher-margin products, such as Intel Core and Intel Xeon CPUs. Given the fact that the company is struggling to meet demand, it is clearly logical for Intel to use older process nodes for chipsets that are rather simple and barely make use of any of the significant advantages of the latest nodes.
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