Details lt1357cs8

lt1357cs8 IC new original

Details lt1357cs8

Theory: esp8266 TSOP IC CHIP NEW lt1357cs8
is_customized: Yes
Contact Load: QFN PLCC TQFP BGA DIP
Voltage: power module communication
Model Number: 1357 LTC1357CS8 LT1357CS8 LT1357 SOP8
Protect Feature: SSOP TSSOP QFP SOP SOIC
Power Source: DC
Usage: General Purpose

lt1357cs8 best
lt1357cs8 best

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Types Of IC

Integrated circuits are often classified by the number of transistors and other electronic components they contain:

SSI (small-scale integration): Up to 100 electronic components per chip lt1357cs8
MSI (medium-scale integration): From 100 to 3,000 electronic components per chip
LSI (large-scale integration): From 3,000 to 100,000 electronic components per chip
VLSI (very large-scale integration): From 100,000 to 1,000,000 electronic components per chip
ULSI (ultra large-scale integration): More than 1 million electronic components per chip

lt1357cs8 price
lt1357cs8 price

There are two major kinds of ICs:
analog (or linear) which are used as amplifiers, timers and oscillators
digital (or logic) which are used in microprocessors and memories
Some ICs are combinations of both analog and digital.

VLSI
Very-large-scale integration lt1357cs8

The final step in the development process, starting in the 1980s and continuing through the present, was “very large-scale integration” (VLSI). The development started with hundreds of thousands of transistors in the early 1980s, and continues beyond several billion transistors as of 2007.

There was no single breakthrough that allowed this increase in complexity, though many factors helped. Manufacturing moved to smaller rules and cleaner fabs, allowing them to produce chips with more transistors with adequate yield, as summarized by the International Technology Roadmap for Semiconductors (ITRS).

lt1357cs8
lt1357cs8

Design tools improved enough to make it practical to finish these designs in a reasonable time. The more energy efficient CMOS replaced NMOS and PMOS, avoiding a prohibitive increase in power consumption. Better texts such as the landmark textbook by Mead and Conway helped schools educate more designers, among other factors.

In 1986 the first one megabit RAM chips were introduced, which contained more than one million transistors. Microprocessor chips passed the million transistor mark in 1989 and the billion transistor mark in 2005 The trend continues largely unabated, with chips introduced in 2007 containing tens of billions of memory transistors

ULSI, WSI, SOC and 3D-IC
To reflect further growth of the complexity, the term ULSI that stands for “Ultra-Large Scale Integration” was proposed for chips of complexity of more than 1 million transistors.

Wafer-scale integration (WSI) is a system of building very-large integrated circuits that uses an entire silicon wafer to produce a single “super-chip”. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term Very-Large-Scale Integration, the current state of the art when WSI was being developed.

System-on-a-Chip (SoC or SOC) is an integrated circuit in which all the components needed for a computer or other system are included on a single chip. The design of such a device can be complex and costly, and building disparate components on a single piece of silicon may compromise the efficiency of some elements.

View lt1357cs8
View lt1357cs8

However, lt1357cs8 these drawbacks are offset by lower manufacturing and assembly costs and by a greatly reduced power budget: because signals among the components are kept on-die, much less power is required (see Packaging, above).

Three Dimensional Integrated Circuit (3D-IC) has two or more layers of active electronic components that are integrated both vertically and horizontally into a single circuit. Communication between layers uses on-die signaling, so power consumption is much lower than in equivalent separate circuits. Judicious use of short vertical wires can substantially reduce overall wire length for faster operation.

The integrated circuit from an Intel 8742, an 8-bit microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip.

Among the most advanced integrated circuits are the microprocessors or “cores”, which control everything from computers to cellular phones to digital microwave ovens. Digital memory chips and ASICs are examples of other families of integrated circuits that are important to the modern information society.

While the cost of designing and developing a complex integrated circuit is quite high, when spread across typically millions of production units the individual IC cost is minimized. The performance of ICs is high because the small size allows short traces which in turn allows low power logic (such as CMOS) to be used at fast switching speeds.

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